U.S. Department of Commerce Appoints First Members to Industrial Advisory Committee
Sep 29, 2022
U.S. Department of Commerce Appoints First Members to Industrial Advisory Committee
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Thu, 09/29/2022 – 12:49
FOR IMMEDIATE RELEASE
Thursday, September 29, 2022
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The recently established committee will advise on CHIPS for America’s R&D efforts.
The U.S. Department of Commerce today announced the appointment of 24 members to the Industrial Advisory Committee (IAC), an advisory body that will provide guidance to the Secretary of Commerce on a range of issues related to domestic semiconductor research and development in support of CHIPS for America. The Committee will not participate in selecting recipients of federal financial assistance, including the manufacturing incentives program.
“CHIPS for America is a once-in-a-generation investment that will position the United States to lead the world in semiconductor research, manufacturing, design, entrepreneurship, and innovation for decades to come,” said Secretary of Commerce Gina M. Raimondo. “The experienced and diverse group of accomplished leaders on the Industrial Advisory Committee will help guide our approach to semiconductor research and innovation as we strengthen America’s global competitiveness.
Mike Splinter, former CEO of Applied Materials, will serve as chair and Susan Feindt, a fellow and executive at Analog Devices, will serve as vice-chair of the Committee.
The Industrial Advisory Committee members announced today are the first appointees for the Committee, established by Congress in the William M. (Mac) Thornberry National Defense Authorization Act of 2021 (FY 2021 NDAA). The Industrial Advisory Committee will provide advice on the science and technology needs of the nation’s domestic microelectronics industry, the national strategy on microelectronics research, the research and development programs and other advanced microelectronics activities funded through CHIPS for America, and opportunities for new public-private partnerships.
The committee comprises leaders from a broad range of disciplines in the microelectronics field, including academia, the semiconductor industry, federal laboratories, and other areas.
The newly appointed members include:
Mike Splinter (Chair), General Partner, MRS Business and Technology Advisors
Susan Feindt (Vice-Chair), Director of Advanced Process Development Group, Analog Devices
James Ang, Chief Scientist, Pacific Northwest National Laboratory
Daniel Armbrust, Founder/Chief Executive Officer, Silicon Catalyst
Susie Armstrong, Senior Vice President of Engineering, Qualcomm
Ahmad Bahai, Chief Technology Officer, Texas Instruments
Bill Chappell, Vice President of Technology, Microsoft
Michael Fritze, Vice President of Microelectronics Policy, Potomac Institute for Policy Studies
Charles Gray, Vice President of Digital Systems Technology, Ford Motor Company
Carol Handwerker, Reinhardt Schuhmann, Jr. Professor of Materials Engineering & Professor of Environmental and Ecological Engineering, Purdue University
Deirdre Hanford, Chief Security Officer, Synopsys
Rajarao Jammy, Chief Technology Officer, MITRE Engenuity
Ken Joyce, Executive Vice President, Brewer Science
Ann Kelleher, Executive Vice President of Tech Development, Intel Corporation
Mukesh Khare, Vice President, IBM Research
Meredith LaBeau, Chief Technology Officer, Calumet Electronics
Tsu-Jae King Liu, Dean of the College of Engineering, University of California Berkley
Om Nalamasu, Chief Technology Officer, Applied Materials
Debo Olaosebikan, CEO and Founder, Kepler Computing
Alex Oscilowski, President, TEL America
Willy Shih, Robert and Jane Cizik Professor of Management Practice in Business Administration, Harvard Business School
Brandon Tucker, Chief Workforce Development Officer, Washtenaw Community College
H.S. Philip Wong, Willard R. and Inez Kerr Bell Professor in the School of Engineering, Stanford University
Anthony Yen, Vice President of Technology and Director of ASML Technology Center
Tags
CHIPS Act
Read the full report from the U.S. Department of Commerce: Read More
